设备概要

- ILD  STI  W  Cu Process 用 CMP Slurry 稀释供给系统

   (Silica, Ceria, Aluminum Slurry 的 on site patch 稀释设备

   稀释精度     目标比重 ± 0.005

- POU 直前混合系统

   Ceria Slurry 和粉散剂的 线上调和

   流量精度    FS ± 1%

- H2O2 浓度管理系统

   W Slurry , Cu Slurry 等的酸化剂调和系统

    浓度精度       目标浓度 ± 0.1wt%

Features

• Correspondence to the various Slurry which diversify (Silica, Ceria, Aluminum base, etc)

• A lot of application experience to 300mm 65nm process

• Stabilization of Polishing process by periodical cleaning by an automatic cleaning system

• Adoption of materials and  parts in consideration of Slurry properties of matter (tank, Pump, Valve, etc)

• Various patent technology for Slurry system (a mixture for mixing, concentration management, particle monitor, etc)